I. Core Technology Advantages
Process Innovation
The integration of copper windings and magnetic materials through a co-firing process combines the high electrical conductivity of copper with the magnetic properties of magnetic materials, achieving high power density and miniaturized design, and breaking through the volume limitations of traditional inductors.
Material Property Upgrades
High-temperature stability: The use of high-temperature sintered alloy powder instead of traditional low-temperature curing materials significantly improves magnetic permeability (μi), saturation magnetic induction (Bs), and thermal conductivity, while greatly reducing core losses.

Ultra-low DC resistance (RDC): Optimized resistance value design effectively reduces energy loss and enhances power conversion efficiency.

Reliability Breakthrough
Durability Test: After 2400 hours of high-temperature load testing, the loss increase rate was only 10% (the loss increase rate of traditional molded inductors exceeded 350%).

Structural stability: No risk of magnetic powder shedding, completely solving the problem of performance degradation caused by organic material aging in traditional inductors.

II. Core Product Matrix and Performance
Zhen Dong SMM Series: Benchmark of Ultra-thin Design

Thickness optimization: 30% - 60% thinner than traditional inductors, suitable for the heat dissipation air duct layout of ultra-thin devices (such as high-end PCs and AI servers).

High current support: Compatible with VRM (Voltage Regulator Module) and TLVR (Coupled Inductor Multi-phase Power Supply) solutions, meeting the transient high current demands of high-performance chips such as GPU/CPU.

Temperature rise control: The surface temperature is reduced by 10% under the same power consumption, significantly improving heat dissipation efficiency.

SMM-MP Series: Upgraded Multi-phase Power Supply System

High integration: Specifically designed for powering AI server GPUs, it supports a wide range of voltage regulation from 12V to 0.8V to 1.3V.

Comprehensive advantages: No howling, low electromagnetic interference (EMI), low loss, and saves over 40% of PCB board space.

III. Application Scenarios Coverage
AI Servers and Data Centers

The core application is used in the GPU/CPU power management module, compatible with the TLVR power supply solution, to achieve stable power supply and heat dissipation optimization in high computing power scenarios.

The field of consumer electronics

Empower the power modules of ultra-thin laptops, tablets and other devices. Enhance the heat dissipation efficiency and reduce the overall thickness of the device through thinning design.

Industrial and communication equipment

Meet the wide-temperature operation requirements of base stations, industrial power supplies and other scenarios, and ensure high reliability under long-term load.





IV. Comparison with Traditional Inductors

Comparison Dimension Copper-Magnetic Co-fired Inductor Traditional Molded Inductor
Structural Stability No magnetic powder shedding, 2400h high-temperature loss +10% Magnetic powder shedding risk, 2400h high-temperature loss +350%
Performance Parameters Same size inductance value/Q value increased by 1.5-2 times Obvious performance degradation
Production Efficiency Full automation production line, stable large-scale mass production High dependence on manual labor, large capacity fluctuations



V. Market Layout and Industry Trends
Zhdong Electronics' Strategic Focus

The copper-magnetic co-fired inductors have been incorporated into the four major technology platforms, with a focus on breaking through in the AI server and data center markets. We have already reached mass production cooperation agreements with several leading customers.

Industry growth drivers

The surging demand for AI computing power is driving up the penetration rate of ultra-thin and high-power inductors, especially making them key components in GPU power supply and server power supplies.

Copper-magnetic co-fired inductors have achieved breakthroughs in power density, reliability and energy efficiency through material science and process innovation, making them a core power solution for high-performance devices in the AIoT era. They have a promising market prospect.